Butt joined electrical apparatus and module

ABSTRACT

A butt joined electrical apparatus has an open end face carrier or housing on which is positioned an electrical element. An electrical device and a coplanar transmission structure is formed on the electrical element with the coplanar transmission structure disposed toward the open end face of the carrier or housing. The electrical device coupled an electrical signal to and from a mating opto-electrical apparatus or housing. The coplanar transmission structure is independently aligned in three mutually perpendicular directions and in a proximate abutting relationship with another matching coplanar transmission structure formed on an opto-electrical element of the mating opto-electrical apparatus or housing. The electrical and opto-electrical apparatuses are independently positioned and mechanically joined together with the matching coplanar transmission structures electrically coupled together via substantially flat electrical conductors.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of the U.S. Provisional ApplicationNo. 60/366,357, filed Mar. 20, 2002.

BACKGROUND OF THE INVENTION

The present invention relates generally to opto-electrical assembliesand more particularly to a butt joined electronic apparatus and moduleoperating at millimeter wavelength frequencies.

Recent advancements in optical communications technology havedemonstrated optical data demuxing at a speed of over 160 Gbit/secthrough a single mode optical fiber. At the same time, there is a lackof corresponding progress in test and measurement instrumentation tosupport analyzing these fast optical pulses. Current solutions arelimited by interconnect issues that limit bandwidth and signalintegrity, and manufacturing issues that can substantially increase thecost of components. One commercial solution is to couple an enclosedphotodetector module with a conventional enclosed sampling head using acoaxial transmission line. The coupled modules are mounted in an opticalplug-in module for a sampling oscilloscope. Another solution is to buy ahigh-speed photodetector as the optical-to-electrical (O/E) converterand use a sampling oscilloscope to capture the signal. This approachseems more beneficial for users because, in addition to having to spendless money, they can also maintain the electrical input to the scope forother testing needs. The inconvenience to users is that the screen is nolonger calibrated for accurate power measurements. However, thisinconvenience can be overcome by purchasing a separate power meter andperform a calibration manually. Users are faced with the choice ofspending more money for the added power level calibration feature of anoptical plug-in module or save $10 to 15 thousand dollars by buying aphotodetector separately such that both electrical inputs and opticalinputs can be measured with the same investment. The latter choice alsoprovides users with a power meter which can be used elsewhere as well.

A common weakness for the above two solutions is that they both needelectrical interconnections to connect the photodetector output to thesampler input. Because of the high frequencies involved, the connectorsare quite expensive. Moreover, aside from introducing additional coststo the system, these components also introduce unwanted impedancemismatching that produce signal reflections. These signal reflectionsresult in waveform distortion as a function of bit pattern whenmeasuring fast repetitive signals, such as the RZ 40 Gb/Sec opticaldata.

A solution to these problems is to combine the detector and samplersemiconductor devices together to form a fully integratedphotodetector-sampler IC design. This would eliminate all of theinterconnecting hardware between the photodiode and sampler. While afully integrated photodetector-sampler design (FIPS) sounds good, itruns into practical problems during implementation. Generally, testequipment manufactures are not vertically integrated companies that havethe processing technology or the equipment to produce FIPS designs. Inaddition, high speed photodetector manufacturers generally specialize inproducing optical components, such as O/E and E/O converters, but notelectrical components, such as electrical samplers. Conversely,electrical component manufactures do not manufacture optical components.To produce the FIPS design would require capital investment andtechnology development by optical or electrical component manufacturesor the test and measurement equipment manufacturer.

Another issue with the FIPS design is yield loss of the final assemblyif either of the optical detector or sampler sections develop problems.The photodiode performance cannot be accurately characterized untilpermanently mounted on or within a carrier or housing, an optical fiberaligned to the photodiode, and electrically coupled to the samplersection. If the output of the competed FIPS device does not meet designspecifications, it is difficult to determine if the problem has to dowith the fiber alignment, photonic and impulse responses of the diode,polarization sensitivity and the like in the optical detector section orsignal gain, sensitivity and the like in the sampler section. Even ifthe performance problem can be identified to one of the sections,replacing the defective section may lead to damage of the other section.

Another problem with the FIPS design is negotiating refunds on defectiveparts. Since different manufacturers make the components for the opticaland sampler sections and one or the other or a system integrator, suchas the test and measurement manufacturer, performs the finalintegration, determining the cause of the failed part or parts in thesections can be a source of conflict. For example, the problem may bedetermined within the photodetector module, say a lower than spec photoresponse. The problem could have been caused by the photodiode die beingdamaged during the FIPS processing; the optical fiber being misalignedfrom the integrator assembly process; the optical fiber end surfacepolishing being flawed; the fiber/detector IC junction having foreigncontaminations not readily visible to the eye; the wire bond from thedetector IC to the sampler IC having excessive inductance introduced byimproper wirebonding; the wirebonder damaging the detector IC byimproper bonding control, such as excess bond head ultrasonic energy orpressure, and the like. The photodetector IC manufacturer may bereluctant to refund the cost of the multi-thousand dollars detector ICwhere the defect is caused by a defective assembly process.

What is needed is an electrical apparatus and module design thatovercomes the shortcomings of the FIPS and the coaxial interconnectdesigns. The electrical apparatus and module design should allowindependent testing and verification of separate sections of theassembly prior to final assembly or integration. The electricalapparatus and module should allow for easy assembly and alignment of theseparate device sections down to the micron level.

SUMMARY OF THE INVENTION

Accordingly, the present invention is to a butt joined electricalapparatus and module for coupling millimeter wavelength frequencyelectrical signals to and from a mating opto-electrical apparatus. Thebutt joined electrical apparatus and module has a carrier with an openend face and an electrical element positioned on the carrier. Theelectrical element has an electrical device formed on at least a firsthorizontal surface of the carrier that is coupled to additionalelectrical circuitry on the. The electrical module configuration has ahousing with sidewalls and end walls. A cavity is formed in the housingbounded on three sides by the sidewalls and one of the end walls. Thecavity intersects the other end wall of the housing defining an open endface on the housing. The housing has the electrical element positionedin the cavity of the housing. The electrical device formed on thehorizontal surface of the electrical element is coupled to additionalcircuitry disposed in the housing. The housing may be provided with aremovable top cover that is mounted on the end wall and the sidewallsbounding the cavity.

The electrical element has a coplanar transmission structure formed onone of the horizontal surfaces that is electrically coupled to theelectrical device. The coplanar transmission structure is independentlyaligned in three mutually perpendicular planes and positioned in aproximate abutting relationship with another matching coplanartransmission structure formed on an opto-electrical element positionedon an open end face carrier or in the cavity of a housing of the matingopto-electrical apparatus. The carrier of the electrical apparatus andthe carrier of the opto-electrical apparatus are independentlypositioned and mechanically joined together at the open end faces as asingle assembly by a securing member. The carrier of the electricalapparatus and carrier of the opto-electrical apparatus are linearly androtationally positionable in three mutually perpendicular planesrelative to each other to align the matching coplanar transmissionstructures of the electrical apparatus and the opto-electricalapparatus. Likewise, the housing of the electrical module and thehousing of the opto-electrical module are independently positioned andmechanically joined together at the open end faces as a single module bya securing member. The housing of the electrical module and housing ofthe opto-electrical module are linearly and rotationally positionable inthree mutually perpendicular planes relative to each other to align thematching coplanar transmission structures of the electrical apparatusand the opto-electrical apparatus. The matching coplanar transmissionstructures of the electrical apparatus and the opto-electrical apparatusare electrically coupled together via substantially flat electricalconductors.

In the preferred embodiment, the securing member has removablemechanical attachment members secured to the side surfaces of the firstand second carriers or modules. The removable attachment members aresecured on the side surfaces of the first and second carriers or modulesadjacent to their respective open end faces. Each removable attachmentmember has first and second links secured to the respective sidesurfaces of the carriers and housings with each link having a base andat least a first extension member. At lest one of the extension membersof each of the first and second removable attachment members projectspast one of the open end faces to overlap the other extension member.The overlapping extension members are secured together to join thecarriers or housings together as a single assembly or module. In thepreferred embodiment, solder is applied to the overlapping extensionmembers. Alternately, an adhesive, such as an epoxy or ultraviolet curedepoxy, may be applied to the overlapping extension members.

The electrical element may be positioned on the carrier of theelectrical apparatus and in the cavity of the electronic module housingaway from the open end face of the carrier and housing. The electricalelement may also extend to the open end face of the carrier or housingor it may extend past the open end face of the carrier or housing. Theelectrical element may be positioned on the carrier or housing in any ofthe above positions so long as the proximate abutting relationship ofthe matched coplanar transmission structures of the electrical apparatusor module and the mating opto-electrical apparatus or module produce asub-millimeter separation between the ends of the matched coplanartransmission structures. For example, the electrical element may be setback from the end face of its carrier or housing and the opto-electricalelement may extend past the open end face of its carrier or housing.

A mounting dielectric substrate may be mounted on the carrier of theelectrical apparatus or in the cavity of the electrical module housing.The substrate has an end face that may be positioned away from the openend face of the carrier or housing, extend to the open end face of thecarrier or housing, or extend past the open end face of the carrier orhousing. The electrical element is secured to the mounting dielectricsubstrate with the electrical element positionable away from, extendingto or extending past the end face of its mounting dielectric substrate.The positioning of the substrate may be combined with the positioning ofthe electrical element to produce multiple positioning combinations. Forexample, the mounting dielectric substrate may be positioned away fromthe open end face of the carrier or housing with the electrical elementextending past the end face of the mounting dielectric substrate. Inanother example, the mounting dielectric substrate may extend past theopen end face of carrier or housing with the electrical elementextending to the end face of the mounting dielectric substrate.

The electrical apparatus may also include a standoff dielectricsubstrate positioned on the open end face carrier in an abuttingrelationship with the electrical element. The standoff dielectricsubstrate has opposing vertical end walls and a horizontal surface witha coplanar transmission structure matching the coplanar transmissionstructure of the electrical element formed on the horizontal surface andextending to the vertical end walls. One of the opposing vertical endwalls abuts the end face of the electrical element with the coplanartransmission structure on the electrical element and the coplanartransmission structure on the standoff dielectric substrate beingcoplanar and electrically coupled via substantially flat electricalconductors. The other end wall of the standoff dielectric substrate isdisposed toward the open end face of the carrier. The standoffdielectric substrate and abutting electrical element may be positionedback from the open end face of the carrier and housings. The standoffdielectric substrate and abutting electrical element may also extend tothe open end face of the carrier or housing or it may extend past theopen end face of the carrier or housing. The standoff dielectricsubstrate and abutting electrical element may also be secured to themounting dielectric substrate with the standoff dielectric substrate andabutting electrical element set back from the end face of the mountingdielectric substrate, extend to the end face or extend past the end faceof the mounting dielectric substrate.

The electrical device formed on the electrical element may be at least afirst sampling diode of a sampling circuit, a laser driver, an amplifieror the like. The opto-electrical device formed on the opto-electricalelement may be an optical-to-electrical converter, such as a photodiode,a semiconductor laser, an optical modulator or other types of devicesthat receives an electrical signal to generate or modulate an opticaldevice or generates an electrical signal in response to a receivedoptical signal.

The objects, advantages and novel features of the present invention areapparent from the following detailed description when read inconjunction with appended claims and attached drawings. dr

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a first embodiment of a buttjoined electrical apparatus according to the present invention.

FIG. 2 is a detailed perspective view of the joined electrical apparatusor module with an associated opto-electrical apparatus or module in thebutt joined electrical and module according to the present invention.

FIG. 3 is a detailed perspective view of the electrical apparatus ormodule having a standoff dielectric substrate that is joined with anassociated opto-electrical apparatus or module in the butt joinedelectrical and module according to the present invention.

FIGS. 4A-4L are side views of various positioning configurations of theelectrical element in the butt joined electrical assembly and moduleaccording to the present invention.

FIG. 5 is a perspective view of a second embodiment of a butt joinedelectrical module according to the present invention.

FIG. 6 is a front perspective view of the mating opto-electricalapparatus and module in the electrical apparatus and module according tothe present invention.

FIG. 7 is a detailed perspective view of the standoff dielectricsubstrate joining dimensionally mismatched coplanar transmissionstructures of the butt joined opto-electrical module according to thepresent invention.

FIG. 8 is a perspective view of the housing of the butt joinedelectrical module according to the present invention illustrating theremovable mechanical attachment members.

FIG. 9 illustrates various views of one embodiment of the links of theremovable attachment members used in the butt joined electricalapparatus and module according to the present invention.

FIG. 10 is a perspective view of the joined electrical and matingopto-electrical housings of the butt joined electrical module accordingto the present invention.

FIG. 11 illustrates various views of a further embodiment of the linksof the removable attachment members used in the butt joined electricalapparatus and module according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The butt joined electrical apparatus and module of the present inventionis an independently positioned and mechanically joined open end facedapparatus that couples extremely high frequency electrical signals, inthe range of 30 GHz. to 300 GHz, to and from a mating opto-electricalapparatus module. FIG. 1 show a perspective view of a first embodimentof a butt joined opto-electronic assembly 10 having an opto-electricalapparatus 12 and an electrical apparatus section 14. The opto-electricalapparatus 12 has a carrier 16 having opposing horizontal surfaces 18 andside surfaces 20 with one of the side surfaces defining an open end face22. The carrier 16 is made of any suitable solid material that providesa rigid base for receiving optical or electrical components, substratesand the like. Such materials include, but not limited to, metals such asbrass or the like, glass, plastic and the like. An opto-electricalelement 24 is positioned on the carrier 16 and secured using anadhesive, such as a conductive or non-conductive epoxy. Theopto-electrical element 24 (as best shown in FIG. 2) has opposinghorizontal surfaces 26 and side surfaces 28 with one of the sidesurfaces defining an end face 30. An opto-electrical device 32, such asan optical-to-electrical converter implemented as a semiconductorphotodiode, a semiconductor laser, an optical modulator or the like, isformed on one of the horizontal surfaces 26 of the opto-electricalelement 24. A coplanar transmission structure 34 is formed on one of thehorizontal surfaces 26 and has one end electrically coupled to theopto-electrical device 32. The other end of the coplanar transmissionstructure 34 is disposed adjacent to the end face 30 of theopto-electrical element 24. An optical waveguide 36, such as an opticalfiber, may be mounted on a substrate 38 as is described in U.S. Pat. No.4,702,547, titled “Method for Attaching an Optical Fiber to a Substrateto form an Optical Fiber Package”. The optical waveguide 36 is opticallyaligned with the opto-electrical device 32 for coupling an opticalsignal to or from the opto-electrical device 32. Alternately, theoptical waveguide 36 may be formed as part of the substrate 38 andoptically aligned with the opto-electrical device 32. The optical fiberis then optically aligned with the substrate optical waveguide.

The electrical apparatus 14 has a carrier 40 of similar design tocarrier 16 of the opto-electronic section 12 with the carrier 40 havingopposing horizontal surfaces 42 and side surfaces 44 with one of theside surfaces defining an open end face 46. The carrier 40 is preferablymade of the same material as the carrier 16 for the opto-electricalapparatus 12. An electrical element 48 is positioned on the carrier 40and secured using an adhesive, such as a conductive or nonconductiveepoxy. The electrical element (as best shown in FIG. 2) has opposinghorizontal surfaces 50 and side surfaces 52 with one of the sidesurfaces defining an end face 54. The electrical element 48 ispreferably formed of a semiconductor material and has an electricaldevice 56, such as a sampling diode, laser driver, amplifier or thelike, formed on one of the horizontal surfaces 50. A coplanartransmission structure 58, matching the coplanar transmission structure34 of the opto-electrical element 24, is formed on one of the horizontalsurfaces 50 and has one end electrically coupled to the electricaldevice 56. The other end of the coplanar transmission structure 58 isdisposed adjacent to the end face 54 of the electrical element 48. Theelectrical element 48 is electrically coupled via an electricalconductor 60, such as bond wires, gold foil and the like, to a substrate62 mounted on the carrier 14 having additional electronic circuitryformed thereon.

The carriers 16 and 40 of the opto-electrical and electrical apparatus12 and 14 are linearly and rotationally positionable relative to eachother in three mutually perpendicular planes as represented by themutually orthogonal planes 64. The apparatuses 12 and 14 are moveableup-and-down in the vertical direction, side-to-side in the horizontaldirection and in-and-out in the lateral direction. A securing member 66joins the respective carrier 16 and 40 together as a single assembly 10.The securing member 66 may take the form of an adhesive 68 applied tothe abutting open end face surfaces 22 and 46 of the carriers 16 and 40.One such adhesive is an epoxy. A drawback to using a standard epoxyadhesive is the long drying time. This can be overcome by forming thecarriers 16 and 40 from a transparent material and using an ultravioletcured epoxy. A drawback to using an adhesive to secure the carriers 16and 40 together is that it difficult to impossible to separate thejoined carriers without damaging them. A preferred securing member isremovable mechanical attachment members 70 that are mounted on opposingsidewalls 20 and 44 of the carriers 16 and 40 adjacent to their open endfaces 22 and 46. Each attachment member 70 has respective first andsecond links 72 and 74 with each link having a base 76 and an extensionmember 78. The links 72 and 74 are preferably made of metal, such asbrass, steel or the like. Each base 72 has a bore 80 formed therethoughthat accepts a threaded screw 82. Each screw 82 is received in athreaded aperture (not shown) formed in the sidewalls 20 and 44 of thecarriers 16 and 40 and tightened to secure the links 72 and 74 to theirrespective carriers 16 and 40. At least one of the extension members 78of the first and second links 72 and 74 extends past the open end face22, 46 of its carrier. The other extension member 78 extends outwardfrom the base 76 toward the open end face 22, 46 of its carrier. Theother extension member 78 may also extend past the open end face of itscarrier. As the two carriers 16 and 40 are positioned together to alignthe matched coplanar transmission structures 34, 58, the extensionmembers 78 overlap each other. Once the coplanar transmission structures34, 58 are aligned, the extension members 78 are secured together tomechanically join the carriers 16 and 40 together as one assembly.Preferably, the extension members 78 are secured together using a 60/40tin-lead solder. Alternately, an adhesive, such as an epoxy, UV curedepoxy or a low melting temperature metal with strong adhesion likeindium, can be used to secure the extension members together. Anadvantage of using the removable attachment members 70 is the ability todisassemble the opto-electronic assembly to replace a defectiveapparatus 12, 14 of the assembly if one of the sections fails. All thatis mechanically required is to remove the screws 82 securing the links72 and 74 to the carriers 14 and 40. This type of disassembly andreplacement of defective components is substantially faster and saferthan attempting to replace opto-electrical and electrical elementsintegrated onto a single substrate.

FIG. 2 is a closeup perspective view of the butt joined interfacebetween the opto-electrical apparatus 12 and the mating electricalapparatus 14. The open end face 22 of the carrier 16 positioned in anapproximate abutting relationship with the open end face 46 of themating electrical apparatus 40. In the preferred embodiment, theopto-electronic element 24 is formed of a semiconductor material withthe opto-electrical device 32 being an optical-to-electrical converter.The optical-to-electrical converter 32 is preferably a photodetectorhaving heterojunction structures bases on III-V semiconductor materials,such as an indium-phosphate (InP) semiconductor photodiode manufacturedand sold by u2t Photonics GmbH, Berlin, Germany. The photodiode 32 isformed at one end of the opto-electrical element 24 and is electricallycoupled to the center conductor of the coplanar transmission structure34 formed on the top horizontal surface of the opto-electrical element.The other end of the coplanar transmission structure 34 is disposedadjacent to the opposing end face 30 of the opto-electrical element 24.The opto-electrical element 24 is positioned and secured to the carrier14 with the end face 30 adjacent to the open end face 22 of the carrierto provide micron separation between the matched coplanar transmissionstructures 34 and 58. Electrical leads (not shown) couple electricalpower to the semiconductor photodiode 32. The dielectric substrate 38has the optical waveguide 36 formed therein and is positioned adjacentto and optically aligned with the photodiode 32 to provide optimumoptical energy input to the photodiode. An optical fiber is opticallyaligned with the waveguide 36 for coupling an optical signal through thewaveguide 36 and onto the photodiode 32.

Alternately, the opto-electrical device 32 may be formed on one of thehorizontal surfaces 26 of the opto-electrical element 24 and thecoplanar transmission structure 34 may be formed on the opposinghorizontal surface 26. Electrically conductive vias couple theelectrical output of the opto-electrical device 32 to the coplanartransmission structure 34.

The electrical element 48 is preferably a gallium-arsenide semiconductordevice having at least a first sampling diode 56 formed thereon forminga sampling circuit. Preferably, the semiconductor device has more thanone sampling diode 56 forming the sampling circuit, such as the samplingcircuit described in U.S. Pat. No. 6,292,052, titled “Output Amplifierfor a Discrete Filter-Les Optical Reference Receiver”. The samplingdiode or diodes 56 are electrically coupled to the center conductor ofthe coplanar transmission structure 58 that extend from the end face 54of the electrical element 48. The sampling diode or diodes 56 areelectrically coupled to a conductive contact pad 90 formed on the topsurface 50 of the electrical element 48 at the opposite end of theelectrical element 48. The substantially flat electrical conductor 60couples the sampled electrical signal from the sampling diode or diodes56 to the additional circuitry formed on an adjacent substrate 62. Suchcircuitry may include amplifiers, summing circuits and the like.Electrical leads (not shown) couple electrical power and biasingvoltages to the electrical element 48. As was described for theopto-electronic element 24, the electrical element 48 may be formed onone of the horizontal surfaces 50 and the coplanar transmissionstructure 58 may be formed on the opposing horizontal surface 50.Electrically conductive vias couple the electrical output of theelectrical device 56 to the coplanar transmission structure 58.

The carriers 16 and 40 are position in an alignment mount with at leastone of the carriers being linearly and rotationally moveable in thethree mutually perpendicular directions relative to the other carrier.The carriers 16 and 40 are positioned to align the matched coplanartransmission structures 34 and 58 in a proximate abutting relationship.The lateral separation of the matching coplanar transmission structures34 and 58 is in the sub-millimeter range with the preferred lateralseparations being as small as possible. The matched coplanartransmission structures 34 and 58 are aligned such that the end faces ofthe opto-electronic and electrical elements 30 and 54 are parallel toeach other and the coplanar transmission structures 34 and 58 lay in thesame plane. Once the matched coplanar transmission structures 34 and 58are aligned in the abutting relationship, the carriers 16 and 40 arejoined together by one of the above described securing members 66. Thematched coplanar transmission structures 34 and 58 are then electricallycoupled together using substantially flat electrical conductors 92, suchas wedge bonded gold ribbon wire, bond wires or the like.

The coplanar transmission structures 34 and 58 are preferably impedanceand dimensionally matched in a 50 ohm environment. However, the use ofdifferent substrate materials for the opto-electrical and electricalelements 24 and 48 may result in 50 ohm coplanar transmission lines ofdiffering dimensions on one of the opto-electrical or electricalelements 24 and 48. Further, the patterned coplanar transmissionstructure 34 formed on the electrical element 24 is formed of thinlayers of gold over an adhesion material, such as titanium and/orplatinum plating. Excessive probing or wire or wedge bonding to thecoplanar transmission structures 34 will remove portions of the goldlayer destroying the electrical connectivity of the transmissionstructure. The flexibility and robustness of the electronic apparatus 11may be increased by adding a standoff dielectric substrate 63 as shownin FIG. 3. The standoff dielectric substrate 63 has opposing horizontalsurfaces 65 and opposing vertical end walls 67 with a coplanartransmission structure 69 formed on one of the horizontal surfaces thatmatches the characteristics of the coplanar transmission structures 34and 58 formed on the opto-electrical and electrical elements 24 and 48.The standoff dielectric substrate 63 is formed of a dielectric material,such as aluminum oxide or the like, with the coplanar elements of thecoplanar transmission structure 69 extending to the end walls 67 of thesubstrate 63. This structure is in contrast to current standoffdielectric substrates where the coplanar transmission structure does notextend to the end walls of the substrate. This is due to the method ofmanufacturing the standoff dielectric substrates. The traditional methodof manufacturing standoff dielectric substrates is to lay down multiplecoplanar transmission structures on the dielectric substrate. Thedielectric substrate is then laser scribed and the individual standoffdielectric substrates are snapped off from the larger dielectricsubstrate. The resulting standoff dielectric substrate has verticallyjagged end walls due to the snapping off process.

Extending the coplanar elements of the coplanar transmission structure69 to the end walls 67 of the standoff dielectric substrate 63 decreasesthe separation between the coplanar transmission structures 34 and 58 onopto-electrical and electrical elements 24 and 48 and the coplanartransmission structure 69 on the standoff dielectric substrate 63. Theprocess for producing a standoff dielectric substrate 63 with a coplanartransmission structure 69 extending to the end walls 67 of the substraterequires the use of low temperature soluble wax to protect the coplanartransmission structure during processing. A number of coplanar waveguidestructures 69 are formed on a wafer of dielectric material using a thinlayer of gold. The low temperature water soluble wax, such as CrystalBond or the like, is placed over the coplanar transmission structures 69to protect the structures during manufacture. Tape is placed over thewax to prevent the wax from being washed off during processing and toprevent the standoff dielectric substrates 63 from being lost duringprocessing. The wafer of dielectric material is then sawn on a line thatintersects the coplanar elements of the coplanar transmission linestructures 69. A coolant, such as a water jet, is applied to the waferduring the sawing process to prevent heat buildup. The wax is used toprevent the coplanar transmission structures 69 from lifting off thewafer during the sawing process. The tape prevent the protects the watersoluble wax from being removed by the water jet. After the end walls 67of each of the standoff dielectric substrates 63 are cut, the tape isremoved and the water soluble wax is washed off the finished substrates63. The standoff dielectric substrate 63 is positioned on the carrier 40of the electrical apparatus 14 in an abutting relationship with theelectrical element 48 and secured using an adhesive, such as aconductive or non-conductive epoxy.

In an alternate cutting process, the standoff dielectric substrate 63may be cut in situ on the carrier 40. The standoff dielectric substrate63 is formed using the above described process with the initial lengthof the substrate 63 being longer than needed. The standoff dielectricsubstrate 63 is mounted on the carrier 40 abutting the end face 46. Thewater soluble wax is applied to the standoff dielectric substrate 63 andthe tape is applied over the wax. The standoff dielectric substrate 63and the carrier 40 are then sawn together with the result being thestandoff dielectric substrate 63 abutting the end face 46 of the carrier40.

The inductance of the coplanar transmission structure 69 should matchthe inductance of the coplanar transmission structures 34 and 58. Wherethe coplanar transmission structures 34 and 58 are dimensionallymatched, as in FIG. 3, the coplanar elements of the coplanartransmission structure 69 of the standoff dielectric substrate 63 hasthe same dimensions across the substrate. Where the coplanartransmission structures 34 and 58 are dimensionally mismatched, thedimensions of the coplanar elements of the coplanar transmissionstructure 69 of the standoff dielectric substrate 63 transition acrossthe substrate from the dimension of the one coplanar transmissionstructure to the dimension of the other coplanar transmission structurewhile maintaining the characteristic impedance from one coplanartransmission structure to the other.

FIGS. 4A through 4L illustrate various positioning configurations forthe electrical element 48 on the electronic apparatus 14 of the presentinvention. Like elements of the previous drawing figures are labeled thesame in FIGS. 4A through 4L. FIG. 4A shows the electrical element 48recessed back from the end face 46 of the carrier 40. The setback of theelectrical element 48 in relation to the electrical opto-element 24 onthe mating opto-electrical apparatus, that is the combined setback ofboth elements, is less than one millimeter. For example, the electricalelement 48 may be setback 900 microns from the end face 46 and theopto-electrical element 24 setback 90 microns from the end face of itscarrier. FIG. 4B illustrates the electrical element 48 extending to theend face 46 of the carrier 40 and FIG. 4C illustrates the electricalelement 48 extending past the end face 46 of the carrier 40.

The electrical apparatus 14 may be provided with a mounting dielectricsubstrate 100. The mounting dielectric substrate has opposing horizontalsurfaces 102 and an end face 104 and may be formed of a alumina-oxidematerial or similar non-conducting material. FIG. 4D illustrates thepositioning of a mounting dielectric substrate 100 on the carrier 40 ofthe electrical apparatus 14 with the electrical element 48 secured tothe mounting dielectric substrate 100. The mounting dielectric substrate100 is shown recessed from the open end face 46 of the carrier 40 withthe electrical element 48 recessed from the end face 104 of the mountingdielectric substrate 100. FIG. 4E illustrates the positioning of themounting dielectric substrate 100 on the carrier 40 at the end face 46of the carrier 40 with the electrical element 48 extending to the endface 104 of the mounting dielectric substrate 100. FIG. 4F illustratesthe positioning of mounting dielectric substrate 100 on the carrier 40with the mounting dielectric substrate 100 extending past the end face46 of the carrier 40 and the electrical element 48 extending past theend face 104 of the mounting dielectric substrate 100.

The above illustrated examples of the positioning of the electricalelement 48 on the carrier 40 and the positioning of the mountingdielectric substrate 100 on the carrier 40 and the positioning of theelectrical element 48 on the mounting dielectric substrate 100 representsome but not all of the possible positioning configuration for theelectronic apparatus 14. Each of the positioning locations for theelectrical element 48 on the carrier 40 may equally be used inpositioning the electrical element 48 on the mounting dielectricsubstrate 100.

FIG. 4G shows the standoff dielectric substrate 63 and abuttingelectrical element 48 recessed back from the end face 46 of the carrier40. FIG. 4H illustrates the standoff dielectric substrate 63 abuttingelectrical element 48 extending to the end face 46 of the carrier 40 andFIG. 41 illustrates the standoff dielectric substrate 63 abutting theelectrical element 48 extending past the end face 46 of the carrier 40.The electrical apparatus 14 may be provided with a mounting dielectricsubstrate 100 as previously described in relation to FIGS. 4D-4F. FIG.4J illustrates the positioning of a mounting dielectric substrate 100 onthe carrier 40 of the electrical apparatus 14 with the electricalelement 48 and the standoff dielectric substrate 63 secured to themounting dielectric substrate 100. The mounting dielectric substrate 100is shown recessed from the open end face 46 of the carrier 40 with thestandoff dielectric substrate 63 and abutting electrical element 48recessed back from the end face 104 of the mounting dielectric substrate100. FIG. 4K illustrates the mounting dielectric substrate extending tothe end face 46 of the carrier 40 with the standoff dielectric substrate63 and abutting electrical element 48 extending to the end face 104 ofthe mounting dielectric substrate 100. FIG. 4L illustrates the mountingdielectric substrate 100 positioned on the carrier 40 and extending pastthe open end face 46 of the carrier 40 with the standoff dielectricsubstrate 63 abutting the electrical element 48 extending past the endface 104 of the mounting dielectric substrate 100.

The above illustrated examples of the positioning of the standoffdielectric substrate 63 with the electrical element 48 on the carrier 40and the positioning of the mounting dielectric substrate 100 on thecarrier 40 and the positioning of the standoff dielectric substrate 63with the electrical element 48 on the mounting dielectric substrate 100represent some but not all of the possible positioning configuration forthe electronic apparatus 14. Each of the positioning locations for thestandoff dielectric substrate 63 with the electrical element 48 on thecarrier 40 may equally be used in positioning the standoff dielectricsubstrate 63 with electrical element 48 on the mounting dielectricsubstrate 100.

Referring to FIG. 5, there is shown a perspective view of a secondembodiment of a butt joined opto-electronic assembly and module 108. Thebutt joined opto-electronic module 108 has an opto-electrical module 110and an electrical module 112. The opto-electrical module 110 has ahousing 114 having sidewalls 116 and 118 and end walls 120 and 122forming a cavity 124 within the housing 114 as shown in the perspectiveview of the opto-electrical housing 114 in FIG. 6. The housing 114 ispreferably made of metal, such as brass or the like. Alternately, thehousing may be made of solid materials, such as plastic, glass or thelike. The cavity 124 is bounded on three sides by the sidewalls 116 and118 and one of the end walls 120. The cavity 124 intersects the otherend wall 122 defining an open end face 126 on the housing 114. Opposingsupport members 128 extend part way into the cavity 124 from thesidewalls 116 and 118 forming a gap 130 there between that support anoptical waveguide alignment member 132. The alignment member 132 had anaperture 134 formed therein that receives an optical waveguide 136 inthe form of an optical fiber. The optical fiber 136 extends through anaperture 138 formed in the bounding end wall 122 of the cavity 124. Theoptical fiber 136 is optically aligned with the opto-electrical device32 formed on the opto-electrical element 24 that is positioned in thecavity 124. The opto-electrical element 24 has the same structure andelements as previously described with the opto-electrical element 24having the coplanar transmission structure 34 formed on one of thehorizontal surfaces 26 of the opto-electrical element 24. Once theoptical fiber 136 is aligned with the opto-electrical device 32, thealignment member 132 is secured to the support members 128. Aspreviously stated, the optical waveguide 136 may be formed as part of asubstrate 38 that is aligned with the opto-electrical device 32. Theoptical fiber is then optically aligned with the substrate opticalwaveguide 136.

The electrical module 112 has a housing 140 having sidewalls 142 and 144and end walls 146 and 148 forming a cavity 150 within the housing 140.The housing 140 is preferably made of metal, such as brass or the like.Alternately, the housing 140 may be made of solid materials, such asplastic, glass or the like. The cavity 150 is bounded on three sides bythe sidewalls 142 and 144 and one of the end walls 146. The cavity 150intersects the other end wall 148 defining an open end face 152 on thehousing 140. In the preferred embodiment, the cavity 150 transitionsfrom a larger cavity area 154 to a smaller cavity area 156 thatintersects the open end face 152 of the housing 140. The transitionallows the joining of the opto-electrical module 110 to the electricalmodule 112. The electrical element 48 is positioned in the smallercavity area 156 adjacent to the open end face 152 of the housing 140.The electrical element 48 has the same structure and elements aspreviously described with the electrical device 56 and coplanartransmission structure 58 formed on one of the horizontal surfaces 50 ofthe electrical element 48. A substantially flat electrical conductor 60couples the sampled electrical signal from the sampling diode or diodesto additional circuitry formed on the adjacent substrate 62. Suchcircuitry may include amplifiers, summing circuits and the like.

The housings 114 and 140 of the opto-electrical and electrical modules110 and 112 are linearly and rotationally positionable relative to eachother in three mutually perpendicular planes as represented by themutually orthogonal planes 160. The modules 110 and 112 are moveableup-and-down in the vertical direction, side-to-side in the horizontaldirection and in-and-out in the lateral direction. The opto-electricaland electrical modules 110 and 112 are joined together as a singleopto-electronic module with the securing members 66 previously describedfor the carrier members 16 and 40. An adhesive 162, such as an epoxy orUV cured epoxy, may be applied to the open end faces 126 and 152 of thehousings 114 and 140 to secure then together. Preferably, the modules110 and 112 are joined together by the removable mechanical attachmentmembers 70 that are mounted on the exterior of the sidewalls 118, 140and 116 and 144 of the housings 114 and 140. The two sets of attachmentmember links 72, 74 are mounted to the sidewalls 118, 140 and 116 and144 adjacent to the open end faces 126 and 152 of the respectivehousings 114 and 140 with threaded screws 82. At least one of theextension members 78 of each of the link sets 72, 74 extends from thebase 76 past the open end face 126, 152 of its housing 114 and 140. Theother extension member 78 extends outward from the base 76 toward theopen end face 126, 152 of its housing 114, 140. The other extensionmember may also extend past the open end face of its housing. As the twohousings 114 and 140 are positioned together to align the matchedcoplanar transmission structures 34 and 58, the extension members 78overlap each other. Once the coplanar transmission structures 34 and 58are aligned, the extension members 78 are secured together tomechanically join the carriers together as one assembly.

The alignment of the matching coplanar transmission structures 34 and 58on the opto-electrical and electrical elements 24 and 48 and the joiningof the housing 114 and 140 to form a single opto-electronic module 108are the same as was described for the aligning the matching coplanartransmission structures 34 and 58 on the opto-electrical and electricalelements 24 and 48 and joining the carriers 16 and 40 together as oneassembly 10 shown in FIG. 2. The housings 114 and 140 are position in analignment mount with at least one of the housings being linearly androtationally moveable in the three mutually perpendicular directionsrelative to the other housing. The housings 114 and 140 are positionedto align the matched coplanar transmission structures 34 and 58 in aproximate abutting relationship. The matched coplanar transmissionstructures 34 and 58 are aligned such that the end faces 30 and 54 ofthe opto-electronic and electrical elements 24 and 48 are parallel toeach other and the coplanar transmission structures 34 and 58 lay in thesame plane. Once the matched coplanar transmission structures 34 and 58are aligned in the abutting relationship, the housings 114 and 140 arejoined together by one of the above described securing members 66. Thematched coplanar transmission structures 34 and 58 are then electricallycoupled together using substantially flat electrical conductors 92, suchas wedge bonded gold ribbon wire, bond wires or the like. Each housing114 and 140 may be fitted with a removable cover 164, 166 that issecured to the respective sidewalls and end wall defining each of thecavities 124 and 150 to prevent stray signals from interfering with theelectrical signals of the opto-electronic module 10 and to preventforeign materials from entering the module. Alternately, the individualcovers 164 and 166 may be combined into a single removable cover that issecured to the sidewalls and end walls defining the cavities 124 and150.

The positioning of the electrical element 48 in the cavity 150 of thehousing 140 of the electronic module 112 is the same as described forthe positioning of the electrical element 48 on the carrier 40 of theopto-electrical apparatus 14 as representatively illustrated in theexamples of FIGS. 4A through 4F. The electrical element 48 ispositionable away from the open end face 152 of the housing 140, or theelectrical element 48 can extend to or extend past the open end face 152of the housing 140. The electrical element 48 may also be secured to themounting dielectric substrates 100 that is positioned in the cavity 150of the housing 140 as previously described. The mounting dielectricsubstrate 100 may be positioned away from the open end face 152 of thehousing 140, or the substrate may extend to the open end face 152 of thehousing 140, or extend past the open end face 152 of the housing 140.The positioning locations for the electrical element 48 in the cavity150 may equally be used in positioning the electrical element 48 on themounting dielectric substrate 100.

The standoff dielectric substrate 63 may also be used in the abuttingrelationship with electrical element 48 positioned in the cavity of thehousing 140. FIG. 7 is a closeup perspective view illustrating thecoplanar transmission structure 58 on the electrical element 48 abuttingthe coplanar transmission structure 69 on the standoff dielectricsubstrate 63. Like elements from the previous drawings are labeled thesame in FIG. 7. The opto-electrical element 24 on the mating electricalmodule 114 has a coplanar transmission structure 34 that isdimensionally different from the coplanar transmission structure 58 onthe electrical element 48. The coplanar transmission structure 69 at theopposing end walls 67 of the standoff dielectric substrate 63 matchesthe dimensions of the coplanar transmission lines 34 and 58 formed onthe opto-electrical and electrical elements 24 and 48. Between theopposing end walls 67, the each of the planar structures coplanartransmission structure 69 dimensionally transitions from one coplanartransmission structure dimension to the other coplanar transmissionstructure dimension. Different dimensioned electrical conductorscorresponding to the dimensions of the different sized coplanartransmission structures electrically coupled the coplanar transmissionstructures together.

The positioning of the standoff dielectric substrate 63 and abutting theelectrical element 48 on the carrier 40 as previously described also maybe applied to positioning of the standoff dielectric substrate 63 andelectrical element 48 in the cavity 150 of the housing 140 of theelectronic module 112 as representatively illustrated in the examples ofFIGS. 4G through 4L. The standoff dielectric substrate 63 and abuttingelectrical element 48 is positionable away from the open end face 152 ofthe housing 140, or the standoff dielectric substrate 63 abutting theelectrical element 48 can extend to or extend past the open end face 152of the housing 140. The standoff dielectric substrate 63 and abuttingelectrical element 48 may also be secured to the mounting dielectricsubstrates 100 that is positioned in the cavity 150 of the housing 140as previously described. The mounting dielectric substrate 100 may bepositioned away from the open end face 152 of the housing 140, or thesubstrate may extend to the open end face 152 of the housing 140, orextend past the open end face 152 of the housing 140. The positioninglocations for the standoff dielectric substrate 63 and abuttingelectrical element 48 in the cavity 150 may equally be used inpositioning the standoff dielectric substrate 63 and abutting electricalelement 48 on the mounting dielectric substrate 100.

Referring to FIG. 8, there is shown a perspective view of the housings114, 140 of the opto-electronic module 108 illustrating in greaterdetail the removable mechanical attachment members 70. Like elementsfrom previous drawing figures are labeled the same. Orthogonal channels300, 302 are preferably formed in the sidewalls 116, 118, 142, 144 ofeach of the housings 114, 140 adjacent to the respective open end faces126, 152 with the horizontal channels 302 extending to the open endfaces. A threaded aperture 304 is formed at the intersection of theorthogonal channels 300, 302. FIG. 9 illustrates various views of oneembodiment of the links 72, 74 of the removable attachment members 70that are secured to the sidewall 116, 118, 142, 144. Each link 72, 74has a base 76 having a front 306, a back 308 and sides 310 withextension members 78A, 78B, 78C extending from one of the sides 310 ofthe base 76. The extension members 78A, 78B and 78C may be plated with alayer of tin-lead to aid in soldering the extension members together.Two extension member 78A, 78B are closer together than a third member78C with the closely spaced extension members 78A, 78B being thinnerthan the third extension member 78C. The base 76 has two coaxiallyaligned bores 312, 314 formed therein with the first bore 312 extendinginto the base 76 from the front 306 and having a larger diameter thanthe second bore 314 that extends through the base 76 to the back 308.The larger sized bore 312 receives the head of the threaded cap screw 82with the shank of the screw extends through the second bore 314. Thethreads of the screw 82 engage the threaded aperture 304 in one of thesidewalls 116, 118, 142, 144 of the housings 114, 140. The back 308 ofthe base 76 has pedestal feet 316 extending toward the second bore 314in the base. Each of the pedestal feet 316 bisects one of the sides 310of the base 76. Two of the pedestal feet 316 engage one of thehorizontal channels 302 formed in the sidewalls 116, 118, 142, 144 ofthe housings 114, 140 and two of the pedestal feet 316 engage theassociated vertical channel 300 formed in the sidewalls 116, 118, 142,144 of the housings 114, 140. The depth of the pedestal feet 316 aregreater than the depth of the channels 300, 302 to prevent the totalsurface of the back 308 of the base 76 from touching the sidewalls 116,118, 142, 144 of the housings 114, 140. This prevents the links 72, 74from transferring excessive heat to the housing 114, 140 during thesoldering of the extension members 78A, 78B, 78C. The positioning of theextension members 78A, 78B, 78C on the side 310 of the base 76 allowsone link design to be used on both housings 114, 140. For example, thelink 72 on the electrical module 112 has the closely spaced extensionmembers 78A, 78B positioned toward the top of the housing 140 and thethicker extension member 78C toward the bottom of the housing 140. Thelink 74 on the opto-electrical module 110 has the thicker extensionmember 78C toward the top of the housing 114 and the two closely spacedextension members 78A, 78B toward the bottom of the housing 114. Whenthe two housing 114, 140 are brought together, the thicker extensionmember 78C on the link 72 secured to the electrical module 112 extendsin between the two closely spaced extension members 78A, 78B on the link74 secured to the opto-electrical module 110. Likewise, the thickerextension member 78C on the link 74 secured to the opto-electricalmodule 110 extends in between the two closely extension members 78A, 78Bon the link 72 secured to the electrical module 112. FIG. 10 is aperspective view of the opto-electrical module 110 and the electricalmodule 112 joined together as an opto-electronic module 108. The modules110, 112 have been positioned to align the matched coplanar transmissionstructures 34 and 58. The extension members 78A, 78B, 78C of the links72, 74 are overlapped and secured together with solder, an adhesive,such as epoxy or a low melting temperature metal with strong adhesionlike indium 318. The amount of extension member overlap is preferably0.040 inches. A single cover 320 is secured to the opto-electrical andelectrical modules 110 and 112 to prevent foreign material from enteringthe opto-electrical module 108 and to prevent stray signals frominterfering with the electrical signals of the opto-electronic module108.

FIG. 11 shows a further embodiment for the links 72, 74 of the removablemechanical attachment members 70. Like elements from the previousdrawing figures are labeled the same. Each link 72, 74 has a base 76with front 306, back 308 and sides 310. The base 76 has two coaxiallyaligned bores 312, 314 formed therein with the first bore 312 extendinginto the base 76 from the front 306 and having a larger diameter thanthe second bore 314 that extends through the base 76 to the back 308.The larger sized bore 312 receives the head of the threaded cap screw 82with the shank of the screw extends through the second bore 314. Twoparallel recessed channels 320 are formed in the back 308 of the base 76defining two ribs 322, 324 adjacent to two of opposing sides and acentral platform 326 of equal height with the ribs 322, 324. Two axiallyaligned pedestal feet 316 are formed on the central platform 326extending from the other opposing sides 310 toward the second bore 314in the base. The pedestal feet 316 engage one of the horizontal channels302 formed in the sidewalls 116, 118, 142, 144 of the housings 114, 140.

The closely spaced extension members 78A, 78B extending from one of thesides of the links 72, 74 are replaced with a solid extension member 330having tangs 332 extending in a perpendicular direction from the solidextension member 330 toward the front of the base. The thicker extensionmember 78C is still retained in the embodiment. When the two housing114, 140 are brought together, the thicker extension member 78C on thelink 72 secured to the electrical module 112 extends in between the twotangs on ths solid extension member on the link 74 secured to theopto-electrical module 110. Likewise, the thicker extension member 78Con the link 74 secured to the opto-electrical module 110 extends inbetween the two tangs on the solid extension member on the link 72secured to the electrical module 112. The overlapping extension members330 and 78C are secured together with solder or the like. The ribs andcentral platform prevent the total surface of the back 308 of the base76 from touching the sidewalls 116, 118, 142, 144 of the housings 114,140. This prevents the links 72, 74 from transferring excessive heat tothe housing 114, 140 during the soldering of the extension members 330and 78C.

Various embodiments of a butt joined electrical apparatus and modulehave been described with the various embodiments providing an electricalapparatus that allows coupling of millimeter wavelength frequencyelectrical signals to an from a mating opto-electrical apparatus andmodule. The electrical apparatus and module has an electrical elementhaving an electrical device coupled to a coplanar transmissionstructure. The electrical element is positionable relative to the openend face of the carrier and housing with the electrical element beingpositionable away from the open end face, extend to the open end face,or extend past the open end face of the carrier and module. Theelectrical apparatus may also include a mounting dielectric substrate onwhich is secured the electrical element. The mounting dielectricsubstrate may be positioned away from the open end face of the carrieror housing, extend to the open end face of the carrier or housing, orextend past the open end face of the carrier or housing. The electricalelement may be positioned away from the end face of its mountingdielectric substrate, extend to the end face of its mounting dielectricsubstrate, or extend past the end face of its mounting dielectricsubstrate. The coplanar transmission structure on the electrical elementis independently aligned in a proximate abutting relationship with acorresponding coplanar transmission structure formed on anopto-electrical element of the mating opto-electrical apparatus ormodule. The carrier and housing of the electrical apparatus and moduleare linearly and rotationally positionable relative to the matingopto-electrical apparatus and housing in three mutually perpendicularplanes to align the matching coplanar transmission structures in theproximate abutting relationship. Securing members mounted on the carrierand housing of the electrical apparatus and housing mechanically couplethe electrical apparatus and module with the mating opto-electricalapparatus and module. The matching coplanar transmission structures onthe electrical element and the opto-electrical element are electricallycoupled together using substantially flat electrical conductors. Theelectrical apparatus and module may also be configured with a standoffdielectric substrate abutting the electrical element. The standoffdielectric substrate is positioned between the electrical element andthe open end face of the carrier and housing of the electrical apparatusand module.

It will be obvious to those having skill in the art that many changesmay be made to the details of the above-described embodiments of thisinvention without departing from the underlying principles thereof. Thescope of the present invention should, therefore, be determined only bythe following claims.

What is claimed is:
 1. A butt joined electrical apparatus for coupling millimeter wavelength frequency electrical signals to and from a mating opto-electrical apparatus comprising: a carrier having an open end face and an electrical element positioned on the carrier with an electrical device formed on at least one horizontal surface of the electrical element; a coplanar transmission structure formed on at least one horizontal surface of the electrical element being electrically coupled to the electrical device, the coplanar transmission structure being independently aligned in three mutually perpendicular planes and in a proximate abutting relationship with another coplanar transmission structure formed on an opto-electrical element positioned on an open end face carrier of the mating opto-electrical apparatus; the carrier of the electrical apparatus and carrier of the opto-electrical apparatus being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single module by a securing member with the carrier of the electrical apparatus and carrier of the opto-electrical apparatus being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the coplanar transmission structures of the electrical apparatus and the opto-electrical apparatus; and substantially flat electrical conductors electrically coupling the coplanar transmission structures of the electrical apparatus and the opto-electrical apparatus together.
 2. The butt joined electrical apparatus as recited in claim 1 wherein the electrical element has an end face and the butt joined electrical apparatus further comprises a standoff dielectric substrate positioned on the open end face carrier and having opposing vertical end walls and at least one horizontal surface with a coplanar transmission structure formed on at least one horizontal surface and extending to the vertical end walls with one of the opposing vertical end walls abutting the end face of the electrical element and the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors.
 3. The butt joined electrical apparatus as recited in claim 2 further comprising a mounting dielectric substrate having an end face, with the mounting dielectric substrate mounted on the open end face carrier having the standoff dielectric substrate and the abutting electrical element positioned thereon.
 4. The butt joined electrical apparatus as recited in claim 2 wherein the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric coplanar transmission structure are impedance and dimensionally matched.
 5. The butt joined electrical apparatus as recited in claim 2 wherein the coplanar transmission structure of the standoff dielectric substrate is an impedance maintaining dimensional transition coplanar waveguide structure.
 6. The butt joined electrical apparatus as recited in claim 1 wherein the open end face carrier further comprises a housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with the electrical element positioned in the cavity at the open end face of the housing.
 7. The butt joined electrical apparatus as recited in claim 6 wherein the electrical element has an end face and the butt joined electrical apparatus further comprises a standoff dielectric substrate positioned in the cavity of the housing and having opposing vertical end walls and at least one horizontal surface with a coplanar transmission structure formed on at least one horizontal surface and extending to the vertical end walls with one of the opposing vertical end walls abutting the end face of the electrical element and the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors.
 8. The butt joined electrical apparatus as recited in claim 7 wherein the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric coplanar transmission structure are impedance and dimensionally matched.
 9. The butt joined electrical apparatus as recited in claim 7 wherein the coplanar transmission structure of the standoff dielectric substrate is an impedance maintaining dimensional transition coplanar waveguide structure.
 10. The butt joined electrical apparatus as recited in claim 1 further comprising a mounting dielectric substrate having an end face, with the mounting dielectric substrate mounted on the open end face carrier having the electrical element positioned thereon.
 11. The butt joined electrical apparatus as recited in claim 1 wherein the electrical device comprises at least a first sampling diode.
 12. The butt joined electrical apparatus as recited in claim 1 wherein the electrical device comprises a laser driver.
 13. A butt joined electrical module for coupling millimeter wavelength frequency electrical signals to and from a mating opto-electrical module comprising: a housing having sidewalls and end walls and a cavity formed in the housing bounded on three sides by the sidewalls and one of the end walls with the cavity intersecting the other end wall defining an open end face on the housing with an electrical element positioned in the cavity of the housing having an electrical device formed on at least one horizontal surface of the electrical element; a coplanar transmission structure formed on at least one horizontal surface of the electrical element and being electrically coupled to the electrical device, the coplanar transmission structure being independently aligned in three mutually perpendicular planes and in a proximate abutting relationship with another coplanar transmission structure formed on an opto-electrical element positioned in a cavity of a similar open end face housing of the mating opto-electrical module; the housing of the electrical module and housing of the opto-electrical module being independently positioned in a proximate abutting relationship at the open end faces and mechanically joined together as a single module by a securing member with the open end face housing of the electrical module and open end face housing of the opto-electrical module being linearly and rotationally positionable in three mutually perpendicular planes relative to each other to align the coplanar transmission structures of the electrical module and the opto-electrical module; and substantially flat electrical conductors electrically coupling the coplanar transmission structures of the electrical module and the opto-electrical module together.
 14. The butt joined electrical module as recited in claim 13 wherein the electrical element has an end face and the butt joined electrical module further comprises a standoff dielectric substrate positioned in the cavity of the open end face housing and having opposing vertical end walls and at least one horizontal surface with a coplanar transmission structure formed on at least one horizontal surface and extending to the vertical end walls with one of the opposing vertical end walls abutting the end face of the electrical element and the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric substrate being coplanar and electrically coupled via substantially flat electrical conductors.
 15. The butt joined electrical module as recited in claim 14 further comprising a mounting dielectric substrate having an end face, the mounting dielectric substrate mounted in the cavity of the open end face housing having the standoff dielectric substrate and the abutting electrical element positioned thereon.
 16. The butt joined electrical module as recited in claim 14 wherein the coplanar transmission structure on the electrical element and the coplanar transmission structure on the standoff dielectric coplanar transmission structure are impedance and dimensionally matched.
 17. The butt joined electrical module as recited in claim 14 wherein the coplanar transmission structure of the standoff dielectric substrate is an impedance maintaining dimensional transition coplanar waveguide structure.
 18. The butt joined electrical module as recited in claim 13 further comprising a mounting dielectric substrate having an end face, the mounting dielectric substrate mounted in the cavity of the open end face housing and having the electrical element secured thereon.
 19. The butt joined electrical module as recited in claim 13 wherein the electrical device comprises at least a first sampling diode.
 20. The butt joined electrical module as recited in claim 13 wherein the electrical device comprises a laser driver.
 21. The butt joined electrical module as recited in claim 13 wherein the open end face housing further comprise a removable top cover mounted on the end wall and the sidewalls bounding the cavity. 